A key component of the H2Ceramic technology is the thermoelectric cooling exchange. The core of the heat exchanger are two thermoelectric metals or semi-conductors that use the Peltier effect to pump heat from one compound to the other compound when current is applied.
As mentioned before, the concept is similar to a refrigerator that uses a refrigerant to move heat out into the environment, but the thermoelectric cooling uses electrons instead of refrigerant.
At the cold compound, energy(heat) is absorbed by electrons as they pass from one element to another while at the hot compound, electrons release the excess energy. Heat sinks and fans are placed at the hot compound to dissipate the heat away from the system.
Reversing the direction of electron flow in a thermoelectric mechanism causes heat to flow in the opposite direction. Plus varying the current allows for tight temperature controls.
Having said so much, it is obvious that H2Ceramic will become the future of processor cooling. It is able to target the cooling level to be just above ambient room temperature. Therefore, for extended CPU life and risk reduction in overclocking, H2Ceramic technology is the way to go.
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