CPU cooling has become more of an issue in recent years as the industry moved to higher frequency processors. CPU clock rates have risen sharply since, producing higher heat generation.
More advanced cooling is often required when a CPU is overclocked in a high-end gaming system. CPU heat output tends to rise exponentially during overclocking. With the rise of overclocking expectations, even liquid cooling solutions and heat sinks are trying hard to keep up. Therefore, a new cooling technology is required.
Let me introduce you to the new H2Ceramic cooling system recently unleashed by Dell. It uses a two-stage cooling process that combines high performance liquid to air heat exchanger, thermoelectric fluid chiller, and control circuitry to optimize CPU cooling with minimal power(Dell Inc, 2007). H2C uses sensors, controls, fan speed management and thermoelectric cooling to keep CPU temperature slightly above room temperature which prevents the formation of humidity condensation or frost.
Thermoelectric cooling modules at the center of the heat exchanger rely on the same concept that is used to counter the effect of direct sunlight on spacecrafts(Dell Inc, 2007). This concept is called the Peltier Effect which pronounces that heat is evolved or absorbed at the junction of two dissimilar metals carrying a small current, depending upon the direction of the current. This is especially useful in transferring or dissipating heat away from the processor.
Thats all for today. In the next post I will be describing more on thermoelectric cooling and the Peltier Effect. So, stay tuned if you are interested.
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